Method and apparatus for establishing electrical contact between

Details Method and apparatus for establishing electrical contact between Method and apparatus for establishing electrical contact between

1997-04-22

2000-09-19

Snow, Walter E.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3102

Patent

active

061217832

ABSTRACT:
A needle is pressed into the backside oxide of a semiconductor wafer and a voltage applied to the wafer greater than the breakdown voltage of the oxide in order to make an electrical contact with the bulk material of the wafer. A capacitor plate is provided proximate to a wafer on a chuck and a Kelvin probe is provided proximate to the wafer. A varying voltage is applied between the chuck and the capacitor plate and a voltage is monitored between the Kelvin probe and the chuck. The monitored voltage remaining constant indicates electrical contact between the chuck and the wafer.

REFERENCES:
patent: 5285151 (1994-02-01), Akamel et al.
patent: 5498974 (1996-03-01), Verkuil et al.

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