Method and apparatus for epoxy loc die attachment

Details Method and apparatus for epoxy loc die attachment Method and apparatus for epoxy loc die attachment

1998-03-05

2000-01-18

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257735, 257783, H01L 23495

Patent

active

060160047

ABSTRACT:
A plurality of lead frames is supplied in frame by frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a device and holds it during in place to cure for a preselected period of time of about one second to each device site with adhesive. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.

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