Optics: measuring and testing – Dimension – Width or diameter
Reexamination Certificate
2006-11-14
2006-11-14
Lee, Hwa (Andrew) (Department: 2877)
Optics: measuring and testing
Dimension
Width or diameter
C356S630000
Reexamination Certificate
active
07136173
ABSTRACT:
An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer (1004) includes an end-point detector. The end-point detector is disposed adjacent the nozzle (1008) used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.
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ACM Research, Inc.
Lee Hwa (Andrew)
Morrison & Foerster / LLP
Punnoose Roy M.
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