Method and apparatus for electrical commoning of circuits

Details Method and apparatus for electrical commoning of circuits Method and apparatus for electrical commoning of circuits

2006-05-02

2006-05-02

Deb, Anjan (Department: 2858)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

For fault location

C324S765010

Reexamination Certificate

active

07038462

ABSTRACT:
Improved methods and apparatus is disclosed for electrical testing of electronic circuits such as those existing in microcircuit devices including chip carriers, printed circuit boards and substrates. The invention provides for the testing of the continuity of electronic circuits in progressively smaller devices having increased density of circuits and having pads closely spaced. A quasi-fluidized bed of conductive particles is provided for effectively contacting pads on a first side of a substrate. Pads on another side of the substrate which are connected to the pads on the first side are then contacted by a test device. The circuit interconnecting respective pads on the two sides of the substrate can then be assessed for electrical continuity.

REFERENCES:
patent: 4287406 (1981-09-01), Davies
patent: 4712674 (1987-12-01), Young
patent: 5008617 (1991-04-01), Czubatyj et al.
patent: 5206585 (1993-04-01), Chang et al.
patent: 5798655 (1998-08-01), Kazama et al.
patent: 5850144 (1998-12-01), Howells et al.
patent: 5910878 (1999-06-01), Mello et al.
patent: 6043670 (2000-03-01), Degani et al.
patent: 6049215 (2000-04-01), Agahdel et al.
patent: 2002/0027444 (2002-03-01), Jones et al.
patent: 2002/0060583 (2002-05-01), Kimura et al.
patent: 2005/0046435 (2005-03-01), Ishikawa et al.

Affiliated with

Also associated with

Rating

Method and apparatus for electrical commoning of circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for electrical commoning of circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for electrical commoning of circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3629771