Method and apparatus for dry processing of substrates

Details Method and apparatus for dry processing of substrates Method and apparatus for dry processing of substrates

1986-04-14

1987-08-18

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156657, 1566591, 156662, 156668, 156345, 204298, H01L 21306, B44C 122, C03C 1500, B29C 3700

Patent

active

046875441

ABSTRACT:
A method and apparatus for dry processing of a substrate is provided. More particularly, a substrate is exposed to a gas, such as an effluent from a gas plasma, having at least one reactive specie, such as a free radical, the gas having substantially no electrically charged particles present. Simultaneously, the substrate is irradiated with ultraviolet radiation to enhance the reaction rate in a controlled manner. Also provided is a means for irradiating the wafer with infrared radiation to heat the wafer independently of the irradiation with ultraviolet radiation.

REFERENCES:
patent: 2841477 (1958-07-01), Hall
patent: 4183780 (1980-01-01), McKenna et al.
patent: 4417948 (1983-11-01), Mayne-Banton et al.
patent: 4529475 (1985-07-01), Okano et al.
patent: 4540466 (1985-09-01), Nishizawa
patent: 4624736 (1986-11-01), Gee et al.
Electronic Parts and Materials, Jun. 1984 Issue, pp. 52-57 (Japanese Monthly Magazine).

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