Method and apparatus for dry processing of substrates

Details Method and apparatus for dry processing of substrates Method and apparatus for dry processing of substrates

1986-01-31

1987-10-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156655, 156668, 156345, 204298, 20419232, 252 791, B44C 122, C03C 1500, C03C 2506, B29C 1708

Patent

active

046996893

ABSTRACT:
A method is provided for removing photoresist from a substrate, wherein the method comprises producing a gas plasma from a gas mixture comprising oxygen, CF.sub.4, nitrogen, and hydrogen; substantially eliminating any electrically charged particles from the plasma to produce a plasma effluent; heating the substrate to a temperature in the range of from about 250 to 300 degrees Centigrade; exposing the substrate and photoresist thereon to the effluent while said temperature is maintained; and simultaneously with the exposure step, irradiating the substrate with collimated ultraviolet radiation.

REFERENCES:
patent: 3664899 (1972-05-01), Wright et al.
patent: 4260649 (1981-04-01), Dension et al.
patent: 4341592 (1982-07-01), Shortes et al.
patent: 4417948 (1983-11-01), Mayne-Banton

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