Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-04-21
1999-12-28
Breneman, Bruce
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
216 67, 156345, H01L 2100, B44C 122, C23F 102
Patent
active
060081333
ABSTRACT:
A method and apparatus for dry etching changes at least one of the effective pumping speed of a vacuum chamber and the gas flow rate to alter the processing of an etching pattern side wall of a sample between first and second conditions. The first and second conditions include the presence or absence of a deposit film, or the presence, absence or shape of a taper angle. Various parameters for controlling the first and second conditions are contemplated.
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Kumihashi Takao
Tachi Shinichi
Tsujimoto Kazunori
Breneman Bruce
Hitachi , Ltd.
Powell Alva C
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