Method and apparatus for directly or indirectly applying a liqui

Coating processes – Direct application of electrical – magnetic – wave – or... – Electrostatic charge – field – or force utilized

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427479, 427480, 427482, 427483, 427485, 427424, 427358, B05D 104, B05D 312

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060634502

ABSTRACT:
The invention relates to a method for directly or indirectly applying a liquid or pasty application medium (2) onto one or both sides of a continuous surface (4), wherein the application medium (2) is applied to the surface (4) in a plurality of single application regions by means of a plurality of single application nozzles (12) spaced apart from one another side by side and/or in succession in the direction of width (B) and/or longitudinal direction of the surface (4) and clearly distanced (D) from the surface (4), the application medium (2) emerging from each of these nozzles, wherein adjacent single application regions each intersect (U) at least in part in their respective edge regions, causing a layer of application medium to be produced across substantially the entire width (B) of the surface (4) to be coated. The invention also relates to an apparatus for performing this method.

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English Abstract of Japanese Patent Document No. JP 60-68080 A, Apr. 18, 1985.
English Abstract of Japanese Patent Document No. JP 08150367 A, Nov. 6, 1996.
English Abstract of Japanese Patent Document No. JP 4-150965 A, May 25, 1992.

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