Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate
2011-04-19
2011-04-19
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Metallic housing or support
C438S117000, C438S126000, C438S127000, C257S667000, C257S676000, C257S678000, C257S787000, C257SE21503, C257SE21504, C257SE23069, C257SE23125
Reexamination Certificate
active
07927923
ABSTRACT:
Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are disclosed. Flow diverting structures may be included in or associated with one or more portions of a lead frame, such as a paddle, tie bars, or lead fingers. Flow diverting structures may also be inserted into a mold in association with semiconductor dice carried on non-lead frame substrates, such as interposers and circuit boards, to preferentially impede, redirect or both impede and redirect the flow of molding compound flowing between and over the semiconductor dice.
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Micro)n Technology, Inc.
Nguyen Dao H
TraskBritt
LandOfFree
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