Method and apparatus for determining endpoint during a polishing

Details Method and apparatus for determining endpoint during a polishing Method and apparatus for determining endpoint during a polishing

1996-11-04

1998-11-03

Rose, Robert A.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 41, B24B 722

Patent

active

058300414

ABSTRACT:
A method and apparatus for determining a planar end point on a workpiece such as a semiconductor wafer in a polishing process for polishing the workpiece to a flat mirror finish. The workpiece having an uneven surface is held by a top ring and pressed against a polishing platen. The workpiece is moved relative to the polishing platen to polish the workpiece, and a change in a frictional force between the workpiece and the polishing platen is detected. A reference time when the workpiece having an uneven surface is polished to a flat surface is determined based on the change of the frictional force between the workpiece and the polishing platen. The time when a certain period of polishing time from the reference time elapses is determined as an endpoint on the workpiece.

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J.D. Warnock, "End Point Detector For Chemi-Mechanical Polisher", IBM Technical Disclosure Bulletin, vol. 31, No. 4, pp. 325-326, IBM Corp., Sep. 1988.
U.S. Patent Application Ser. No. 08/588,241, filed Jan. 18, 1996, entitled "Polishing Endpoint Detection Method", by Norio Kimura et al.

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