Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate
2005-01-11
2005-01-11
Gutierrez, Diego (Department: 2859)
Thermal measuring and testing
Leak or flaw detection
With heating or cooling of specimen for test
C374S124000, C374S137000
Reexamination Certificate
active
06840667
ABSTRACT:
A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.
REFERENCES:
patent: 5052816 (1991-10-01), Nakamura et al.
patent: 5127726 (1992-07-01), Moran
patent: 5208528 (1993-05-01), Quintard
patent: 5246291 (1993-09-01), Lebeau et al.
patent: 5250809 (1993-10-01), Nakata et al.
patent: 5582485 (1996-12-01), Lesniak
patent: 5984522 (1999-11-01), Koizumi
patent: 6146014 (2000-11-01), Bruce et al.
patent: 6269719 (2001-08-01), Easton et al.
patent: 6273603 (2001-08-01), Cheindline et al.
patent: 6360935 (2002-03-01), Flake
patent: 6517236 (2003-02-01), Sun et al.
Cournoyer Alain
Levesque Marc
Pastor Marc
Schlagheck Jerry
Allen Kenneth R.
Guadalupe Yaritza
Gutierrez Diego
Photon Dynamics, Inc.
Townsend and Townsend / and Crew LLP
LandOfFree
Method and apparatus for detection of defects using thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for detection of defects using thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for detection of defects using thermal... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3408987