Method and apparatus for detecting an end-point in chemical...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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Details

C451S006000, C451S008000, C451S009000, C451S010000, C451S041000, C451S285000, C451S286000, C451S287000, C451S288000

Reexamination Certificate

active

06913511

ABSTRACT:
An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.

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