Method and apparatus for designing a pattern on a...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C716S030000

Reexamination Certificate

active

06934928

ABSTRACT:
A method of forming a pattern of elements is shown. In one embodiment, the method is used to create a reticle. In another embodiment, the method is used to further form a number of elements on a surface of a semiconductor wafer. Identified problem structures or regions in a pattern of elements are moved from lower level cells of a hierarchy structure into higher level cells before edge movement takes place. Because all cells have been selectively leveled first, substantially all external influences to cells have been removed for each cell before edge movement takes place. The methods and procedures described herein therefore reduce the possibility of undesirable modifications such as electrical shorts. The methods and procedures described herein also reduce overall processing time.

REFERENCES:
patent: 4871688 (1989-10-01), Lowrey
patent: 4957878 (1990-09-01), Lowrey et al.
patent: 5087951 (1992-02-01), Chance et al.
patent: 5223083 (1993-06-01), Cathey et al.
patent: 5358601 (1994-10-01), Cathey
patent: 5625568 (1997-04-01), Edwards et al.
patent: 5674785 (1997-10-01), Akram et al.
patent: 5733711 (1998-03-01), Juengling
patent: 5739585 (1998-04-01), Akram et al.
patent: 5808360 (1998-09-01), Akram
patent: 5821014 (1998-10-01), Chen et al.
patent: 5834366 (1998-11-01), Akram
patent: 5840598 (1998-11-01), Grigg et al.
patent: 5871870 (1999-02-01), Alwan
patent: 5885734 (1999-03-01), Pierrat et al.
patent: 5925410 (1999-07-01), Akram et al.
patent: 5959347 (1999-09-01), Grigg et al.
patent: 5976964 (1999-11-01), Ball
patent: 6008070 (1999-12-01), Farnworth
patent: 6013948 (2000-01-01), Akram et al.
patent: 6030731 (2000-02-01), Yang
patent: 6034440 (2000-03-01), Ball
patent: 6063650 (2000-05-01), King et al.
patent: 6083767 (2000-07-01), Tjaden et al.
patent: 6093655 (2000-07-01), Donohoe et al.
patent: 6121070 (2000-09-01), Akram
patent: 6143580 (2000-11-01), Wells et al.
patent: 6165887 (2000-12-01), Ball
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6206754 (2001-03-01), Moore
patent: 6213845 (2001-04-01), Elledge
patent: 6234878 (2001-05-01), Moore
patent: 6238273 (2001-05-01), Southwick
patent: 6248611 (2001-06-01), Grigg et al.
patent: 6269472 (2001-07-01), Garza et al.
patent: 6370679 (2002-04-01), Chang et al.
patent: 6421820 (2002-07-01), Mansfield et al.
patent: 6425117 (2002-07-01), Pasch et al.
patent: 6457157 (2002-09-01), Singh et al.
patent: 6470489 (2002-10-01), Chang et al.
patent: 6584610 (2003-06-01), Wu et al.
patent: 6667531 (2003-12-01), Ireland et al.
patent: 6732345 (2004-05-01), Kato
patent: 6753115 (2004-06-01), Zhang et al.
patent: 6782524 (2004-08-01), Rittman
patent: 6795961 (2004-09-01), Liebmann et al.
patent: 2001/0002304 (2001-05-01), Pierrat et al.
patent: 2001/0005566 (2001-06-01), Kotani et al.
patent: 2001/0013115 (2001-08-01), Juengling
patent: 2003/0118917 (2003-06-01), Zhang et al.
patent: 2003/0149955 (2003-08-01), Ohnuma
patent: 2003/0152843 (2003-08-01), Tang
patent: 2004/0019868 (2004-01-01), Li
patent: 2004/0181765 (2004-09-01), Kato

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for designing a pattern on a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for designing a pattern on a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for designing a pattern on a... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3476719

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.