Method and apparatus for depositing tungsten after surface...

Details Method and apparatus for depositing tungsten after surface... Method and apparatus for depositing tungsten after surface...

2007-07-03

2007-07-03

Toledo, Fernando L. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S127000, C257SE23119

Reexamination Certificate

active

11130515

ABSTRACT:
A method and system to form a refractory metal layer over a substrate includes introduction of a reductant, such as PH3or B2H6, followed by introduction of a tungsten containing compound, such as WF6, to form a tungsten layer. It is believed that the reductant reduces the fluorine content of the tungsten layer while improving the step coverage and resistivity of the tungsten layer. It is believed that the improved characteristics of the tungsten film are attributable to the chemical affinity between the reductants and the tungsten containing compound. The chemical affinity provides better surface mobility of the adsorbed chemical species and better reduction of WF6at the nucleation stage of the tungsten layer. The method can further include sequentially introducing a reductant, such as PH3or B2H6, and a tungsten containing compound to deposit a tungsten layer. The formed tungsten layer can be used as a nucleation layer followed by bulk deposition of a tungsten layer utilizing standard CVD techniques. Alternatively, the formed tungsten layer can be used to fill an aperture.

REFERENCES:
patent: 4486487 (1984-12-01), Skarp
patent: 4951601 (1990-08-01), Maydan et al.
patent: 5306666 (1994-04-01), Izumi
patent: 5374570 (1994-12-01), Nasu et al.
patent: 5526244 (1996-06-01), Bishop
patent: 5711811 (1998-01-01), Suntola et al.
patent: 5804488 (1998-09-01), Shih et al.
patent: 5834372 (1998-11-01), Lee
patent: 5916365 (1999-06-01), Sherman
patent: 6015590 (2000-01-01), Suntola et al.
patent: 6042652 (2000-03-01), Hyun et al.
patent: 6139700 (2000-10-01), Kang et al.
patent: 6156382 (2000-12-01), Rajagopalan et al.
patent: 6174809 (2001-01-01), Kang et al.
patent: 6197683 (2001-03-01), Kang et al.
patent: 6200893 (2001-03-01), Sneh
patent: 6203613 (2001-03-01), Gates et al.
patent: 6207302 (2001-03-01), Sugiura et al.
patent: 6207487 (2001-03-01), Kim et al.
patent: 6218298 (2001-04-01), Hoinkis
patent: 6270572 (2001-08-01), Kim et al.
patent: 6284646 (2001-09-01), Leem
patent: 6287965 (2001-09-01), Kang et al.
patent: 6305314 (2001-10-01), Sneh et al.
patent: 6333260 (2001-12-01), Kwon et al.
patent: 6335280 (2002-01-01), van der Jeugd
patent: 6342277 (2002-01-01), Sherman
patent: 6348376 (2002-02-01), Lim et al.
patent: 6355561 (2002-03-01), Sandhu et al.
patent: 6358829 (2002-03-01), Yoon et al.
patent: 6368954 (2002-04-01), Lopatin et al.
patent: 6369430 (2002-04-01), Adetutu et al.
patent: 6372598 (2002-04-01), Kang et al.
patent: 6391785 (2002-05-01), Satta et al.
patent: 6399491 (2002-06-01), Jeon et al.
patent: 6416577 (2002-07-01), Suntoloa et al.
patent: 6416822 (2002-07-01), Chiang et al.
patent: 6420189 (2002-07-01), Lopatin
patent: 6423619 (2002-07-01), Grant et al.
patent: 6428859 (2002-08-01), Chiang et al.
patent: 6447933 (2002-09-01), Wang et al.
patent: 6451119 (2002-09-01), Sneh et al.
patent: 6451695 (2002-09-01), Sneh
patent: 6458701 (2002-10-01), Chae et al.
patent: 6468924 (2002-10-01), Lee et al.
patent: 6475276 (2002-11-01), Elers et al.
patent: 6475910 (2002-11-01), Sneh
patent: 6478872 (2002-11-01), Chae et al.
patent: 6482262 (2002-11-01), Elers et al.
patent: 6482733 (2002-11-01), Raaijmakers et al.
patent: 6482740 (2002-11-01), Soininen et al.
patent: 6511539 (2003-01-01), Raaijmakers et al.
patent: 6534395 (2003-03-01), Werkhoven et al.
patent: 6548424 (2003-04-01), Putkonen
patent: 6551929 (2003-04-01), Kori et al.
patent: 6569501 (2003-05-01), Chiang et al.
patent: 6573180 (2003-06-01), Won
patent: 6576565 (2003-06-01), Chakravarti et al.
patent: 6596636 (2003-07-01), Sandhu et al.
patent: 6599572 (2003-07-01), Saanila et al.
patent: 6607976 (2003-08-01), Chen et al.
patent: 6620723 (2003-09-01), Byun et al.
patent: 6630201 (2003-10-01), Chiang et al.
patent: 6632279 (2003-10-01), Ritala et al.
patent: 6635965 (2003-10-01), Lee et al.
patent: 6660126 (2003-12-01), Nguyen et al.
patent: 6686271 (2004-02-01), Raaijmakers et al.
patent: 6790773 (2004-09-01), Drewery et al.
patent: 6815285 (2004-11-01), Choi et al.
patent: 6936538 (2005-08-01), Byun
patent: 2001/0000866 (2001-05-01), Sneh et al.
patent: 2001/0002280 (2001-05-01), Sneh
patent: 2001/0009140 (2001-07-01), Bondestam et al.
patent: 2001/0009695 (2001-07-01), Saanila et al.
patent: 2001/0024387 (2001-09-01), Raaijmakers et al.
patent: 2001/0028924 (2001-10-01), Sherman
patent: 2001/0029094 (2001-10-01), Mee-Young et al.
patent: 2001/0034123 (2001-10-01), Jeon et al.
patent: 2001/0041250 (2001-11-01), Werkhoven et al.
patent: 2001/0050039 (2001-12-01), Park
patent: 2001/0054730 (2001-12-01), Kim et al.
patent: 2001/0054769 (2001-12-01), Raaijmakers et al.
patent: 2002/0000598 (2002-01-01), Kang et al.
patent: 2002/0004293 (2002-01-01), Soininen et al.
patent: 2002/0007790 (2002-01-01), Park
patent: 2002/0019121 (2002-02-01), Pyo
patent: 2002/0021544 (2002-02-01), Cho et al.
patent: 2002/0031618 (2002-03-01), Sherman
patent: 2002/0037630 (2002-03-01), Agarwal et al.
patent: 2002/0041931 (2002-04-01), Suntola et al.
patent: 2002/0048635 (2002-04-01), Kim et al.
patent: 2002/0048880 (2002-04-01), Lee
patent: 2002/0052097 (2002-05-01), Park
patent: 2002/0055235 (2002-05-01), Agarwal et al.
patent: 2002/0060363 (2002-05-01), Xi et al.
patent: 2002/0061612 (2002-05-01), Sandhu et al.
patent: 2002/0068458 (2002-06-01), Chiang et al.
patent: 2002/0073924 (2002-06-01), Chiang et al.
patent: 2002/0074588 (2002-06-01), Lee
patent: 2002/0076481 (2002-06-01), Chiang et al.
patent: 2002/0076507 (2002-06-01), Chiang et al.
patent: 2002/0076508 (2002-06-01), Chiang et al.
patent: 2002/0076837 (2002-06-01), Hujanen et al.
patent: 2002/0081844 (2002-06-01), Jeon et al.
patent: 2002/0086111 (2002-07-01), Byun et al.
patent: 2002/0086507 (2002-07-01), Park et al.
patent: 2002/0090829 (2002-07-01), Sandhu et al.
patent: 2002/0094689 (2002-07-01), Park
patent: 2002/0104481 (2002-08-01), Chiang et al.
patent: 2002/0105088 (2002-08-01), Yang et al.
patent: 2002/0106536 (2002-08-01), Lee et al.
patent: 2002/0106846 (2002-08-01), Seutter et al.
patent: 2002/0109168 (2002-08-01), Kim et al.
patent: 2002/0117399 (2002-08-01), Chen et al.
patent: 2002/0121241 (2002-09-01), Nguyen et al.
patent: 2002/0121697 (2002-09-01), Marsh
patent: 2002/0135071 (2002-09-01), Kang et al.
patent: 2002/0144655 (2002-10-01), Chiang et al.
patent: 2002/0144657 (2002-10-01), Chiang et al.
patent: 2002/0146511 (2002-10-01), Chiang et al.
patent: 2002/0155722 (2002-10-01), Satta et al.
patent: 2002/0162506 (2002-11-01), Sneh et al.
patent: 2002/0164421 (2002-11-01), Chiang et al.
patent: 2002/0164423 (2002-11-01), Chiang et al.
patent: 2002/0177282 (2002-11-01), Song
patent: 2002/0182320 (2002-12-01), Leskela et al.
patent: 2002/0187256 (2002-12-01), Elers et al.
patent: 2002/0187631 (2002-12-01), Kim et al.
patent: 2002/0197402 (2002-12-01), Chiang et al.
patent: 2002/0197863 (2002-12-01), Mak et al.
patent: 2003/0013300 (2003-01-01), Byun
patent: 2003/0013320 (2003-01-01), Kim et al.
patent: 2003/0031807 (2003-02-01), Elers et al.
patent: 2003/0032281 (2003-02-01), Werkhoven et al.
patent: 2003/0042630 (2003-03-01), Babcoke et al.
patent: 2003/0049931 (2003-03-01), Byun et al.
patent: 2003/0049942 (2003-03-01), Haukka et al.
patent: 2003/0053799 (2003-03-01), Lei
patent: 2003/0054631 (2003-03-01), Raaijmakers et al.
patent: 2003/0082296 (2003-05-01), Elers et al.
patent: 2003/0082300 (2003-05-01), Todd et al.
patent: 2003/0082301 (2003-05-01), Chen et al.
patent: 2003/0089308 (2003-05-01), Raaijmakers
patent: 2003/0101927 (2003-06-01), Raaijmakers
patent: 2003/0104126 (2003-06-01), Fang et al.
patent: 2003/0116087 (2003-06-01), Nguyen et al.
patent: 2003/0121241 (2003-07-01), Belke
patent: 2003/0121342 (2003-07-01), Buri
patent: 2003/0123216 (2003-07-01), Yoon et al.
patent: 2003/0129826 (2003-07-01), Werkhoven et al.
patent: 2003/0134508 (2003-07-01), Raaijmakers et al.
patent: 2003/0143328 (2003-07-01), Chen et al.
patent: 2003/0143839 (2003-07-01), Raaijmakers et al.
patent: 2003/0143841 (2003-07-01), Yang et al.
patent: 2003/0153181 (2003-08-01), Yoon et al.
patent: 2003/0161952 (2003-08-01), Wang et al.
patent: 2003/0165615 (2003-09-01), A

Affiliated with

Also associated with

Rating

Method and apparatus for depositing tungsten after surface... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for depositing tungsten after surface..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for depositing tungsten after surface... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3754130