Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate
2008-04-29
2008-04-29
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
C438S460000, C438S462000, C438S464000, C438S128000, C257S620000, C257SE21596, C257SE21599
Reexamination Certificate
active
07364983
ABSTRACT:
A process is disclosed for creating semiconductor devices such as RFID assemblies wherein an array of dies mounted to a substrate is spaced apart at a first pitch, and the substrate is removed after the positions of the dies in the array is fixed by a solidifiable substance. The solidifiable substance is then removed without changing the relative positions of the dies in the array. All or a selected portion of the array of dies is then electrically attached to a plurality of straps or interposers arranged in a corresponding array. The spacing, or pitch, between the dies in the die array may be changed before or after the substrate is removed to match the pitch of the straps or interposers in the corresponding array. An RFID device created using the process inventive is also disclosed.
REFERENCES:
patent: 3497948 (1970-03-01), Wiesler et al.
patent: 3568307 (1971-03-01), Zanger et al.
patent: 3859723 (1975-01-01), Hamer et al.
patent: 4346514 (1982-08-01), Makizawa et al.
patent: 4590667 (1986-05-01), Simon
patent: 4627151 (1986-12-01), Mulholland et al.
patent: 4941255 (1990-07-01), Bull
patent: 5628855 (1997-05-01), Hartmann et al.
patent: 6121118 (2000-09-01), Jin et al.
patent: 6204092 (2001-03-01), Freund et al.
patent: 6527964 (2003-03-01), Smith et al.
patent: 6566744 (2003-05-01), Gengel
patent: 6613610 (2003-09-01), Iwafuchi et al.
patent: 6848162 (2005-02-01), Arneson et al.
patent: 7023347 (2006-04-01), Arneson et al.
patent: 2003/0211652 (2003-11-01), Summers
patent: 2004/0020036 (2004-02-01), Arneson et al.
patent: 2004/0020037 (2004-02-01), Arneson et al.
patent: 2004/0020038 (2004-02-01), Arneson et al.
patent: 2004/0020039 (2004-02-01), Arneson et al.
patent: 2004/0020040 (2004-02-01), Arneson et al.
patent: 2004/0192011 (2004-09-01), Roesner
patent: 2004/0250417 (2004-12-01), Arneson et al.
patent: 2004/0250949 (2004-12-01), Arneson et al.
patent: 2005/0005434 (2005-01-01), Arneson et al.
patent: 2005/0009232 (2005-01-01), Arneson et al.
patent: 2005/0015970 (2005-01-01), Arneson et al.
patent: 0075491 (1987-01-01), None
patent: 0949662 (1999-10-01), None
patent: 0982762 (2005-04-01), None
patent: 3-30442 (1991-02-01), None
PCT Written Opinion of the International Searching Authority (PCT Rule 43 bis.1): International Application No. PCT/US06/19642, International Filing Date May 19, 2006, Priority Date May 19, 2005, Applicant Avery Dennison Corp.
Akhave Jay
Edwards Dave N.
Kian Kouroche
Licon Mark
Mehrabi Ali
Avery Dennison Corporation
Patent Group Law Department Avery Dennison Corporation
Thai Luan
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