4. Semiconductor device manufacturing: process
  5. Bonding of plural semiconductor substrates
  6. Subsequent separation into plural bodies

Kouroche Kian

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method and apparatus for creating RFID devices

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method and apparatus for creating RFID devices

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method and apparatus for creating RFID devices

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for patterning a multilayered conductor/substrate...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for patterning a multilayered conductor/substrate...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Kouroche Kian does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Kouroche Kian, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Kouroche Kian will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-2236233

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure