Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2007-08-28
2007-08-28
Siek, Vuthe (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
10335246
ABSTRACT:
A system for creating efficient vias between metal layers in semiconductor designs that employ diagonal wiring is disclosed. The system combines advantages of both octagonal shaped vias and square shaped vias. Specifically, octagonal shaped vias are ideal for integrated circuit layouts that contain diagonal wiring since the diagonal wiring may be placed closer to the center the via due to the bevel corners. However, octagonal vias are difficult to manufacture. Square vias have been traditionally used within integrated circuits and the techniques to manufacture square vias are well-known. Since the final manufactured output of an ideal square via is similar to the final output of an ideal octagonal via, one system that may be employed is to design an integrated circuit with octagonal vias and then replace those octagonal shaped vias with square vias just before manufacturing. The replacement square vias must be chose to produce an output shape that is very similar to the output of the ideal octagonal via.
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Fujimura Akira
Teig Steven
Cadence Design Systems Inc.
Siek Vuthe
Stattler Johansen & Adeli LLP
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