Method and apparatus for correcting the angles of cut of quartz

Details Method and apparatus for correcting the angles of cut of quartz Method and apparatus for correcting the angles of cut of quartz

1982-03-18

1983-11-22

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156645, 156654, 156663, B44C 122, C03C 1500, C03C 2506

Patent

active

044167261

ABSTRACT:
An improvement in the technique of correcting the angles of cut of quartz resonator plates is disclosed. Photolytic etching the crystal blanks comprises the preferred method. Flat-pack or pill-box type holders include masking members which mask the appropriate portion of the blank. Teflon and Kalrez comprise preferred materials for fabricating the masking elements since such materials are resistant to the etching material utilized. Mesas are formed during etching and the blanks are thereafter lapped to provide the desired angle of cut. When desirable, the masking element is withdrawn at a uniform rate during etching so that the angle is corrected without the need for lapping.

REFERENCES:
patent: 3489564 (1972-01-01), Schaefer
patent: 3694677 (1972-09-01), Guttwein et al.
patent: 3803774 (1974-04-01), Miller
patent: 3951728 (1976-04-01), Egashira et al.
Proceedings of the 30th Annual Symposium on Frequency Control, (1976), pp. 59-263, "A Method of Angle Correction", D. Husgen, et al.
Proceedings of 1980 IEEE Ultrasonics Symposium, "What Saw Can Learn From Baw . . . ", T. Lukaszek, et al.

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