Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-04-18
2006-04-18
Chawan, Sheela (Department: 2623)
Image analysis
Applications
Manufacturing or product inspection
C382S151000, C257SE23179, C438S460000
Reexamination Certificate
active
07031509
ABSTRACT:
There are provided a recognition device, a wafer turning member, a turning device, and a control device. A first detection point for recognition and a second detection point for recognition are recognized, on the basis of the result of which a semiconductor wafer is turned to correct the inclination of ICs on the semiconductor wafer. As a result, the recognition operation for detecting the inclination of the ICs when a position of the ICs is to be recognized for bump formation is eliminated. The number of times the recognition is performed is reduced in comparison with the conventional art, so that the productivity can be improved.
REFERENCES:
patent: 4929893 (1990-05-01), Sato et al.
patent: 5119168 (1992-06-01), Misawa
patent: 5566876 (1996-10-01), Nishimaki et al.
patent: 5644245 (1997-07-01), Saitoh et al.
patent: 6070783 (2000-06-01), Nakazato
patent: 6193132 (2001-02-01), Shibata et al.
patent: 6284568 (2001-09-01), Yamamoto
patent: 6445203 (2002-09-01), Yamashita et al.
patent: 6476499 (2002-11-01), Hikita et al.
Ikeya Masahiko
Kanayama Shinji
Mae Takaharu
Narita Shoriki
Tsuboi Yasutaka
Chawan Sheela
Matsushita Electric - Industrial Co., Ltd.
Wenderoth , Lind & Ponack, L.L.P.
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