Method and apparatus for cooling rectangular substrates

Heat exchange – With retainer for removable article – Electrical component

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165 801, 118 52, 118728, 269903, F28F 700

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055094643

ABSTRACT:
A rectangular substrate is cooled while it is processed under vacuum in a reaction chamber on a rectangular cooling pedestal having a cooling surface that has a downwardly curving convex shape. The substrate is clamped to the pedestal such that it conforms with a pedestal cooling surface profile. As a result the number of voids between the substrate surface and the pedestal cooling surface are minimized. This promotes consistent cooling of the substrate across the entire substrate surface when the substrate is processed at high RF power levels, by allowing the substrate to be subjected to high levels of backside cooling medium pressure which efficiently propagates heat across such gap from the substrate to the pedestal.

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