Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2003-11-18
2009-11-03
McDonald, Rodney G (Department: 1795)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192300, C204S192320, C204S192350, C216S066000
Reexamination Certificate
active
07611610
ABSTRACT:
An improved method of controlling topographical variations when milling a cross-section of a structure, which can be used to reduce topographical variation on a cross-section of a write-head in order to improve the accuracy of metrology applications. Topographical variation is reduced by using a protective layer that comprises a material having mill rates at higher incidence angles that closely approximate the mill rates of the structure at those higher incidence angles. Topographical variation can be intentionally introduced by using a protective layer that comprises a material having mill rates at higher incidence angles that do not closely approximate the mill rates of the structure at those higher incidence angles.
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Arjavac Jason H.
Nadeau James P.
Zou Pei
Fei Company
Griner David
McDonald Rodney G
Scheinberg Michael O.
Scheinberg & Griner LLP
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