Method and apparatus for controlling simultaneous etching of fro

Details Method and apparatus for controlling simultaneous etching of fro Method and apparatus for controlling simultaneous etching of fro

1988-09-22

1989-08-15

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156639, 156653, 156657, 156345, B44C 122, C03C 1500, C03C 2506

Patent

active

048571423

ABSTRACT:
An enclosed chamber is provided to confine wafers to be processed with an etchent gas, and requiring moisture at the surface of the wafer in order to initiate the etching. Gases flowed over the face of the wafer and may be flowed across the backside of the wafer to controllably produce or restrict the etching, according to the nature of the gas supplied and flowed across the wafer.

REFERENCES:
patent: 4339297 (1982-07-01), Aigo
patent: 4544446 (1985-10-01), Cady
patent: 4749440 (1988-06-01), Blackwood et al.

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