Method and apparatus for controlling CMP pad surface finish

Details Method and apparatus for controlling CMP pad surface finish Method and apparatus for controlling CMP pad surface finish

2005-09-06

2005-09-06

Thomas, David B. (Department: 3723)

Abrading

Abrading process

Glass or stone abrading

C451S056000, C451S008000

Reexamination Certificate

active

06939207

ABSTRACT:
A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.

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Copy of pending U.S. Appl. No. 10/100,740, entitled “Method And Apparatus For Conditioning Fixed-Abrasive Polishing Pads”, filed Mar. 19, 2002.

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