Method and apparatus for controlling bonding load of fine lead e

Details Method and apparatus for controlling bonding load of fine lead e Method and apparatus for controlling bonding load of fine lead e

1995-09-22

1997-04-01

Ramsey, Kenneth J.

Metal fusion bonding

Process

With condition responsive, program, or timing control

228 9, 22818022, 228105, H01L 21603

Patent

active

056158220

ABSTRACT:
In this invention, a designed value of a lead width is previously input and a bonding load suitable for the designed lead width is previously input before the step of continuously bonding a TAB tape on a semiconductor chip is effected. Next, the TAB tape and chip are carried to preset positions, and after recognition of the positions of the tape and chip and the alignment of the tape and chip by use of a CCD camera are completed, the inner lead width is actually measured by use of the CCD camera. The measured lead width is compared with the designed lead width, and when a difference therebetween exceeds a preset reference value, the bonding load is changed to a bonding load suitable for the measured lead width of the lead to be actually bonded based on the ratio of the measured lead width to the designed lead width and then the bonding operation is effected by the suitable bonding load.

REFERENCES:
patent: 5240165 (1993-08-01), Geyer et al.
patent: 5314105 (1994-05-01), Farassat

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