Method and apparatus for controlled spray etching

Details Method and apparatus for controlled spray etching Method and apparatus for controlled spray etching

1991-11-07

1993-07-20

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156345, 156664, H01L 2100

Patent

active

052289494

ABSTRACT:
A method and apparatus is provided for controlled spray etching, in which panels, such as printed circuit boards are delivered through an etching chamber, to have a spray etchant sprayed generally on upper and lower surfaces of the panel. The spray is controlled such that a reduced amount of etchant is provided on the perimeter surface portions of the panel, relative to the central surface portions of the panel, transversely of the path of travel of the panels through the etching chamber. The spray may be varied in amount, preferably by varying the pressure at different locations transversely of the chamber; the spray longitudinally through the chamber, may vary, to spray leading and trailing surface portions of the panels a lesser amount than central portions of the panels, measured longitudinally. The control of the spray of leading and trailing surface portions of the panels may be facilitated by one or more sensors that control an intermittent discharge of spray etchant near the inlet to the etch chamber.

REFERENCES:
patent: 3808067 (1974-04-01), Brown
patent: 4126510 (1978-11-01), Moscony et al.
patent: 4352994 (1982-10-01), Inzoli et al.
patent: 4397708 (1983-08-01), Frantzen
patent: 4662976 (1987-05-01), Homuller
patent: 4741798 (1988-05-01), Haas
patent: 4985111 (1991-01-01), Ketelholm
patent: 5002627 (1991-03-01), Scheithauer et al.
"Adjustable Nozzles for Spray Etchers"--IBM Technical Disclosure Bulletin; May 12, 1971, p. 3753; Heilemann et al.
Japanese Abstract 59-93881 (in English) for Application No. 57-202505.
Hollmuller PCP System Technology; no date given.
Fine-Line Etching; no date given.
Aetztechnik Fuer Feinstleiter; no date given

Affiliated with

Also associated with

Rating

Method and apparatus for controlled spray etching does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for controlled spray etching, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for controlled spray etching will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1757940