Method and apparatus for conditioning a polishing pad with...

Details Method and apparatus for conditioning a polishing pad with... Method and apparatus for conditioning a polishing pad with...

2005-04-05

2005-04-05

Hail, III, Joseph J. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S072000, C451S285000, C451S443000, C051S302000, C438S633000

Reexamination Certificate

active

06875091

ABSTRACT:
A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.

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U.S. patent application Ser. No. 09/475,518: “Method and Apparatus for Conditioning a Polishing Pad”; Inventor: Finkelman; Filed: Dec. 30, 1999.
U.S. patent application Ser. No. 09/540,385: “Method and Apparatus for Chemically-Mechanically Polishing Semiconductor Wafers”; Inventors; Travis et al.; Filed Mar. 31, 2000.
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U.S. Pending patent application Ser. No. 09/754,702, Entitled “Method and Apparatus for Conditioning a Polishing Pad With Sonic Energy,”.

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