Method and apparatus for conditioning a polishing pad used in ch

Details Method and apparatus for conditioning a polishing pad used in ch Method and apparatus for conditioning a polishing pad used in ch

1998-11-09

2000-07-11

Banks, Derris H.

Abrading

Abrading process

With tool treating or forming

451443, 451444, B24B 100

Patent

active

060864605

ABSTRACT:
A method and apparatus for conditioning a polishing pad is described. The method includes steps of moving a cylindrical roller having an abrasive substance affixed to it against a moving polishing pad. The roller may be passively rotated by contact with the polishing pad, or actively reciprocated, while maintaining a pressure against the polishing pad. The apparatus includes a cylindrical roller attached to one or more pressure application devices mechanically connected to the roller.

REFERENCES:
patent: 3753269 (1973-08-01), Budman
patent: 4318250 (1982-03-01), Klievoneit et al.
patent: 4672985 (1987-06-01), Mohr
patent: 4720939 (1988-01-01), Simpson et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5335453 (1994-08-01), Baidy et al.
patent: 5484323 (1996-01-01), Smith
patent: 5531635 (1996-07-01), Mogi et al.
patent: 5536202 (1996-07-01), Appel et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5575707 (1996-11-01), Talieh et al.
patent: 5593344 (1997-01-01), Weldon et al.
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5622526 (1997-04-01), Phillips
patent: 5643044 (1997-07-01), Lund
patent: 5655951 (1997-08-01), Meikle et al.
patent: 5692947 (1997-12-01), Taleih et al.
patent: 5725417 (1998-03-01), Robinson
patent: 5779526 (1998-07-01), Gill
U.S. Patent Application Serial No. 08/968,333 entitled "Method and Apparatus for Polishing Semiconductor Wafers" filed Nov. 12, 1997, Attorney Docket No. 7103/32.

Affiliated with

Also associated with

Rating

Method and apparatus for conditioning a polishing pad used in ch does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for conditioning a polishing pad used in ch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for conditioning a polishing pad used in ch will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-536437