Method and apparatus for conditioning a polishing pad

Details Method and apparatus for conditioning a polishing pad Method and apparatus for conditioning a polishing pad

2005-05-31

2005-05-31

Wilson, Lee D. (Department: 3723)

Abrading

Abrading process

With tool treating or forming

C451S285000, C451S299000, C051S302000

Reexamination Certificate

active

06899601

ABSTRACT:
A method and apparatus for conditioning a polishing pad is described. The method includes applying a stream of pressurized liquid to the polishing pad, and removing a significant amount of slurry and liquid from the polishing pad using a vacuum. The apparatus includes a liquid distribution unit forming at least one opening upon which liquid is forced through at high pressure, the opening directed at the polishing pad, and a liquid recovery unit positioned downstream from the liquid distribution unit and in communication with the polishing pad, the liquid recovery unit connected with a vacuum for removing liquid and slurry from the polishing pad.

REFERENCES:
patent: 5536202 (1996-07-01), Appel et al.
patent: 5762536 (1998-06-01), Pant et al.
patent: 6022266 (2000-02-01), Bullard et al.
patent: 6099393 (2000-08-01), Katagiri et al.
patent: 6468134 (2002-10-01), Gotkis
patent: 6572453 (2003-06-01), Wijekoon et al.
patent: 6626743 (2003-09-01), Boyd

Affiliated with

Also associated with

Rating

Method and apparatus for conditioning a polishing pad does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for conditioning a polishing pad, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for conditioning a polishing pad will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3419498