Method and apparatus for cleaning the edge of a thin disc

Cleaning and liquid contact with solids – Apparatus – With means to movably mount or movably support the work or...

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Details

134147, 134184, 134902, B08B 312

Patent

active

061197084

ABSTRACT:
A method and apparatus for cleaning wafer edges is provided. The inventive wafer cleaner employs a transducer equal in length to the diameter of a wafer to be cleaned, and positioned to direct sonic energy in line with the wafer's edge. Supporting and rotating mechanisms are positioned along the wafer's edge, outside of the transducer's high energy field, and preferably such that approximately 50 percent of the wafer is positioned between the wafer supports and the transducer. Therefore, minimal sonic energy is blocked from reaching the wafer's surface. The transducer dimensions relative to the wafer, and the positioning of the wafer supports relative to the transducer enable the system to achieve an approximately 50 percent edge cleaning duty cycle as the wafer is rotated.

REFERENCES:
patent: 4869278 (1989-09-01), Bran
patent: 5090432 (1992-02-01), Bran
patent: 5379785 (1995-01-01), Ohmori et al.
patent: 5383484 (1995-01-01), Thomas et al.
patent: 5672212 (1997-09-01), Manos
STEAG Electronic Systems CMP--"STEAG announces the Trident 300 Post-CMP Cleaner".

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