Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2003-12-23
2009-08-04
Kornakov, Mikhail (Department: 1792)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S100100, C134S102100, C134S137000, C134S142000, C134S157000, C134S099100, C134S902000, C156S345510, C156S345550
Reexamination Certificate
active
07568490
ABSTRACT:
An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer, such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer, is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.
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de Larios John M.
Farber Jeffrey
Korolik Mikhail
Owczarz Aleksander
Ravkin Mike
Brinks Hofer Gilson & Lione
Ko Stephen
Kornakov Mikhail
Lam Research Corporation
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