Method and apparatus for cleaning semiconductor etching machines

Details Method and apparatus for cleaning semiconductor etching machines Method and apparatus for cleaning semiconductor etching machines

1992-04-16

1993-08-31

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

134 1, 156657, 1566591, 156662, 156345, B44C 122, C03C 1500, H01L 21306

Patent

active

052405559

ABSTRACT:
A method and apparatus for cleaning polymer contamination within etching machines during the processing of semiconductor wafers includes the use of a polygonal cleaning wafer on an electrode within the etching chamber during an oxygen plasma cleaning operation. Normal etching of semiconductor wafers in the chamber results in a build-up of deposits (polymer contamination) of the semiconductor wafer etch processing on walls of the etching chamber and on the electrode. The polygonal cleaning wafer, which is typically octagonal, exposes an annular ring of on a supporting electrode adjacent to each flat of the octagonal cleaning wafer. The cleaning wafer is preferably made of the same material as the interior of the etching machine to avoid contamination by foreign elements The presence of the cleaning wafer enables sensing circuits within the etching machine to activate radio frequency power which is used to create an oxygen plasma.

REFERENCES:
patent: 4576698 (1986-03-01), Gallagher et al.
patent: 4657616 (1987-04-01), Benzing et al.
patent: 4985113 (1991-01-01), Fujimoto et al.
patent: 5114529 (1992-05-01), Masuyama et al.
patent: 5158644 (1992-10-01), Cheung et al.

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