Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With mechanical mask – shield or shutter for shielding workpiece
Reexamination Certificate
2005-01-04
2005-01-04
Hassanzadeh, Parviz (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With mechanical mask, shield or shutter for shielding workpiece
C156S345330, C156S345510, C118S728000, C216S067000, C438S710000, C438S714000
Reexamination Certificate
active
06837967
ABSTRACT:
A plasma edge cleaning apparatus is configured to remove film deposits from a wafer edge. A gas distribution manifold is annular shaped and positioned to provide plasma process gases near the edge of the wafer. A top insulator and a wafer support each include a magnetic coil to generate a magnetic field for shielding the selected portions of a wafer from the generated plasma. The top insulator is positioned above the wafer during edge processing so as to form a small gap between the top insulator and the wafer to prevent plasma from etching active die areas of the wafer.
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Barber Rennie G.
Berman Michael J.
Reder Steven E.
Hassanzadeh Parviz
LSI Logic Corporation
Thomas Beyer Weaver
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