Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2007-02-20
2007-02-20
Hail, III, Joseph J. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S043000, C451S059000, C451S303000, C451S307000
Reexamination Certificate
active
11242705
ABSTRACT:
An apparatus for cleaning a semiconductor wafer edge is provided. The apparatus includes a film with an abrasive layer configured to contact the edge surface of a semiconductor substrate coated with a contaminant residue layer. A first reel having the film wound thereon and a second reel for receiving the film fed from the first reel are included. In one embodiment, a third reel configured to force the abrasive layer of the film against the edge surface of the semiconductor substrate so as to create an area of contact between the abrasive layer and the edge surface of the semiconductor substrate; and a pin that protrudes from to the top surface of the third reel. A system and method for cleaning a semiconductor wafer edge are also provided.
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Boyd John M.
Owczarz Aleksander
Redeker Fritz
Ryder Jason
Hail III Joseph J.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
Scruggs Robert
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