Method and apparatus for cleaning a semiconductor substrate

Details Method and apparatus for cleaning a semiconductor substrate Method and apparatus for cleaning a semiconductor substrate

2005-01-04

2005-01-04

Kornakov, M. (Department: 1746)

Cleaning and liquid contact with solids

Processes

Including work heating or contact with combustion products

C134S001000, C134S001300, C134S002000, C134S026000, C134S032000, C134S033000, C134S902000, C156S345110, C156S345180, C156S345210, C156S345230

Reexamination Certificate

active

06837943

ABSTRACT:
A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the stripping solution is in contact with the substrate. The stripping solution, containing particles to be cleaned off the substrate, is then removed from the substrate.

REFERENCES:
patent: 6025575 (2000-02-01), Park et al.
patent: 6312556 (2001-11-01), Donohoe et al.
patent: 6402974 (2002-06-01), Trevor et al.
patent: 6495215 (2002-12-01), Kamikawa
patent: 20020092542 (2002-07-01), Park et al.
patent: 02009483 (1990-01-01), None
patent: 411125917 (1999-05-01), None
patent: 20000164555 (2000-06-01), None
patent: 20011351774 (2001-12-01), None

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