Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2006-08-22
2006-08-22
Wu, Jingge (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
C382S108000, C382S199000, C356S069000, C250S559360, C702S034000, C348S128000
Reexamination Certificate
active
07095884
ABSTRACT:
The present invention provides a circuit pattern edge inspection method of finding out a failure in a fabricating process and image distortion in an observing apparatus by analyzing, by a non-destructive inspection, the shape of an edge of a line of a fine pattern in which characteristics of the material, process, and an exposure optical system in a semiconductor fabricating process appear, and performing analysis quantitatively. The method includes a step of detecting a set of edge points indicative of positions of edges of the pattern in a two-dimensional plane by a threshold method; a step of obtaining an approximation line for the set of edge points detected; and a step of obtaining an edge roughness shape and a characteristic by calculating the difference between the set of the edge points and the approximation line. A plurality of values are used as thresholds used for the threshold method.
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Iizumi Takashi
Komuro Osamu
Otaka Tadashi
Terasawa Tsuneo
Yamaguchi Atsuko
Antonelli, Terry Stout and Kraus, LLP.
Carter Aaron
Hitachi , Ltd.
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