Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2000-03-31
2002-08-06
Morgan, Eileen P. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S059000, C451S168000, C451S164000, C451S297000, C451S307000
Reexamination Certificate
active
06428394
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to polishing and planarization of semiconductor wafers. More particularly, the present invention relates to a method and apparatus for linearly reciprocating a portion of a continuous polishing member to process a semiconductor wafer.
BACKGROUND
Chemical mechanical planarization/polishing (CMP) techniques are used to planarize and polish each layer of a semiconductor wafer. Available CMP systems, commonly called wafer polishers, often use a rotating wafer carrier that brings the wafer into contact with a polishing pad rotating in the plane of the wafer surface to be planarized. A chemical polishing agent or slurry containing microabrasives and surface modifying chemicals is applied to the polishing pad to polish the wafer. The wafer holder then presses the wafer against the rotating pad and is rotated to polish and planarize the wafer. Some available wafer polishers use orbital motion, or a linear belt, rather than a rotating surface to carry the polishing head. One challenge faced in polishing semiconductor wafers using a disposable polishing pad on the available wafer polishers is that these polishers typically need to be frequently stopped to replace the polishing member after a limited number of uses. Accordingly, there is a need for a method and system of performing CMP that addresses this issue.
REFERENCES:
patent: 3753269 (1973-08-01), Budman
patent: 4318250 (1982-03-01), Kilevoneit et al.
patent: 4720939 (1988-01-01), Simpson et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5335453 (1994-08-01), Baldy et al.
patent: 5484323 (1996-01-01), Smith
patent: 5536202 (1996-07-01), Appel et al.
patent: 5547417 (1996-08-01), Breivogel et al.
patent: 5558568 (1996-09-01), Talieh et al.
patent: 5575707 (1996-11-01), Talieh et al.
patent: 5593344 (1997-01-01), Weldon et al.
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5622526 (1997-04-01), Phillips
patent: 5643044 (1997-07-01), Lund
patent: 5655951 (1997-08-01), Meikle et al.
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5692950 (1997-12-01), Rutherford et al.
patent: 5759918 (1998-06-01), Hoshizaki et al.
patent: 5762536 (1998-06-01), Pant et al.
patent: 5871390 (1999-02-01), Pant et al.
patent: 5885143 (1999-03-01), Ichikawa et al.
patent: 5897426 (1999-04-01), Somekh
patent: 5899798 (1999-05-01), Trojan et al.
patent: 5908530 (1999-06-01), Hoshizaki et al.
patent: 5913716 (1999-06-01), Mucci et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 6001004 (1999-12-01), Botteghi
patent: 6068542 (2000-05-01), Hosokai
patent: 6179709 (2001-01-01), Redeker et al.
patent: WO 98/45090 (1998-10-01), None
patent: WO 99/22908 (1999-05-01), None
Engdahl Erik
Krusell Wilbur
Mooring Ben
Travis Glenn
Brinks Hofer Gilson & Lione
Lam Research Corporation
Morgan Eileen P.
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