Method and apparatus for breaking and separating dies from a waf

Details Method and apparatus for breaking and separating dies from a waf Method and apparatus for breaking and separating dies from a waf

1995-01-03

1998-01-20

Bowers, Jr., Charles L.

Fishing, trapping, and vermin destroying

216 84, H01L 21302

Patent

active

057100659

ABSTRACT:
An apparatus for breaking a wafer into individual devices, and a method of using the same. An anvil 100 is pressed against a flexible membrane 304 on which a wafer 300 is attached. A vacuum is applied to the anvil 100 which allows the flexible membrane 304 and the wafer 300 to be pressed against the face of the anvil 100. As the flexible membrane 304 is deformed against the anvil 100, the wafer 300 breaks into individual devices 302. Dicing debris that is created when the wafer 300 is broken falls into a base fixture 408 so that the debris does not contact and damage the devices 302.

REFERENCES:
patent: 3677875 (1972-07-01), Althouse
patent: 4296542 (1981-10-01), Gotman
patent: 5227001 (1993-07-01), Tamaki et al.

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