Method and apparatus for bonding outer leads of a liquid crystal

Details Method and apparatus for bonding outer leads of a liquid crystal Method and apparatus for bonding outer leads of a liquid crystal

1993-08-10

1995-02-28

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156247, 156378, 359 50, 359 82, 359 83, B32B 3100

Patent

active

053933591

ABSTRACT:
There is shown an apparatus for bonding outer leads of a display panel to metal leads of a bonding tape that includes a movable stage for supporting the display panel. A light source is provided on the stage that is positioned beneath the outer leads of the panel, when mounted on the stage. A means is provided to support the bonding tape so that the metal leads are held in overlapping position over the outer leads. A means to observe the resultant overlapped leads is located over the light source. A heat source for applying heat to the aligned leads to form bonds therebetween is provided.

REFERENCES:
patent: 4469553 (1984-09-01), Whitehead
patent: 4731282 (1988-03-01), Tsukagoshi et al.
patent: 5056296 (1991-10-01), Ross et al.
patent: 5063538 (1991-11-01), Kuehnle
patent: 5074035 (1991-12-01), Tyznik

Affiliated with

Also associated with

Rating

Method and apparatus for bonding outer leads of a liquid crystal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for bonding outer leads of a liquid crystal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for bonding outer leads of a liquid crystal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-845819