Method and apparatus for blanket aluminum CVD on spherical integ

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

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438677, 118723R, 118716, 427253, 42725528, H01L 2144

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active

061177725

ABSTRACT:
A method and apparatus for metal-organics chemical vapor deposition (MO CVD) of a metal layer upon a spherical substrate at atmospheric pressure are disclosed. The method includes pretreating the spherical substrate with a vapor of a first precursor in preparation for a deposition of a metal layer. The pretreated spherical substrate is then exposed to a thermally dissociated precursor of metal for depositing the metal layer onto the spherical substrate, wherein the exposure to the thermally dissociated precursor of metal provides a uniformly deposited metal layer coverage over the pretreated spherical substrate. The deposited metal layer is then annealed and cooled.

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Using In-Situ Copper Doped Aluminum Chemical Vapor Deposition, IEDM 97, pp. 781-784.

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