Method and apparatus for automatic measurement of pad...

Details Method and apparatus for automatic measurement of pad... Method and apparatus for automatic measurement of pad...

2007-01-30

2007-01-30

Chawan, Sheela (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S151000, C382S168000

Reexamination Certificate

active

10389475

ABSTRACT:
An image of a semiconductor interconnection pad is analyzed to determine a geometric description of the zone regions of a multiple zone semiconductor interconnection pad. Edge detection machine vision tools are used to extract features in the image. The extracted features are analyzed to derive geometric descriptions of the zone regions of the pad, that are applied in semiconductor device inspection, fabrication, and assembly operations.

REFERENCES:
patent: 5978521 (1999-11-01), Wallack et al.
patent: 6078700 (2000-06-01), Sarachik
patent: 6813377 (2004-11-01), Gopalakrishnan et al.
patent: 6823044 (2004-11-01), Rosner
patent: 6950548 (2005-09-01), Bachelder et al.
patent: 6987875 (2006-01-01), Wallack

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