Method and apparatus for automated rule-based sourcing of...

Data processing: artificial intelligence – Knowledge processing system – Knowledge representation and reasoning technique

Reexamination Certificate

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Reexamination Certificate

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07987150

ABSTRACT:
Automated defect sourcing systems identify root-causes of yield excursions due to contamination, process faults, equipment failure and/or handling. They perform this function in timely manner and provide accurate and timely feedback to address and contain the sources of yield excursion. A signature repository stores known wafer surface manufacturing defect types as set of rules. The signature of a manufacturing defect pattern is associated with the equipment or process that causes the defects, and is used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature rule-based engine matches wafer defects against the signature repository during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.

REFERENCES:
patent: 2007/0288185 (2007-12-01), Burch et al.
Tyagi et al. “Defect Clustering Viewed Through Generalized Poisson Distribution”, IEEE, SM, vol. 5, No. 3, 1992, pp. 196-206.
Tobin et al. “Integrated applications of inspection data in the semiconductor manufacturing environment,” in Metrology-based Control for Micro-Manufacturing, vol. 4275 of SPIE Proceedings, 2001, pp. 31-40.
Lin “Parametric Wafer Map Visualization”, IEEE Computer Graphics and Applications, 1999, pp. 1-4.
Hugo A. D. do Nascimento et al. “Interactive graph clustering based on user hints”, 2001, Lecturer of the Instituto de Informática, UFG—Brazil, 7 pages.

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