Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-06-30
2009-11-10
Thai, Luan C (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S782000, C257S777000, C257S784000, C257SE27137, C257SE27144, C257SE27161
Reexamination Certificate
active
07615871
ABSTRACT:
A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surface. A quantity of adhesive material can be applied to the projection to form an attachment structure, and the adhesive material can be connected to a microelectronic substrate with the attachment structure providing no electrically conductive link between the microelectronic substrate and the support member. The microelectronic substrate and the support member can then be electrically coupled, for example, with a wire bond. In one embodiment, the projection can be formed by disposing a first material on a support member while the first material is at least partially flowable, reducing the flowability of the first material, and disposing a second material (such as the adhesive) on the first material.
REFERENCES:
patent: 4563811 (1986-01-01), Cranston
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5139973 (1992-08-01), Nagy et al.
patent: 5208188 (1993-05-01), Newman
patent: 5252857 (1993-10-01), Kane et al.
patent: 5422435 (1995-06-01), Takiar et al.
patent: 5518957 (1996-05-01), Kim
patent: 5535101 (1996-07-01), Miles et al.
patent: 5593927 (1997-01-01), Farnworth et al.
patent: 5614766 (1997-03-01), Takasu et al.
patent: 5656857 (1997-08-01), Kishita
patent: 5677566 (1997-10-01), King et al.
patent: 5696033 (1997-12-01), Kinsman
patent: 5739585 (1998-04-01), Akram et al.
patent: D394844 (1998-06-01), Farnworth et al.
patent: D402638 (1998-12-01), Farnworth et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5855821 (1999-01-01), Chau et al.
patent: 5866953 (1999-02-01), Akram et al.
patent: 5871808 (1999-02-01), Thompson, Sr.
patent: 5876498 (1999-03-01), Thompson, Sr.
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 5891753 (1999-04-01), Akram
patent: 5893726 (1999-04-01), Farnworth et al.
patent: 5898224 (1999-04-01), Akram
patent: 5920118 (1999-07-01), Kong
patent: 5925930 (1999-07-01), Farnworth et al.
patent: 5933713 (1999-08-01), Farnworth
patent: 5938956 (1999-08-01), Hembree et al.
patent: 5946553 (1999-08-01), Wood et al.
patent: 5956236 (1999-09-01), Corisis et al.
patent: 5958100 (1999-09-01), Farnworth et al.
patent: 5986209 (1999-11-01), Tandy
patent: 5989941 (1999-11-01), Wensel
patent: 5990566 (1999-11-01), Farnworth et al.
patent: 5994784 (1999-11-01), Ahmad
patent: RE36469 (1999-12-01), Wood et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6008074 (1999-12-01), Brand
patent: 6017776 (2000-01-01), Jiang et al.
patent: 6020624 (2000-02-01), Wood et al.
patent: 6020629 (2000-02-01), Farnworth et al.
patent: 6025728 (2000-02-01), Hembree et al.
patent: 6028365 (2000-02-01), Akram et al.
patent: 6046496 (2000-04-01), Corisis et al.
patent: 6048744 (2000-04-01), Corisis et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6049125 (2000-04-01), Brooks et al.
patent: 6051878 (2000-04-01), Akram et al.
patent: 6063647 (2000-05-01), Chen et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6072236 (2000-06-01), Akram et al.
patent: 6075288 (2000-06-01), Akram
patent: 6089920 (2000-07-01), Farnworth et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6107680 (2000-08-01), Hodges
patent: 6114753 (2000-09-01), Nagai et al.
patent: 6114769 (2000-09-01), Thompson, Sr.
patent: 6117382 (2000-09-01), Thummel
patent: 6118176 (2000-09-01), Tao et al.
patent: 6124634 (2000-09-01), Akram et al.
patent: 6133066 (2000-10-01), Murakami
patent: 6150717 (2000-11-01), Wood et al.
patent: 6153924 (2000-11-01), Kinsman
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6172419 (2001-01-01), Kinsman
patent: 6175149 (2001-01-01), Akram
patent: 6175159 (2001-01-01), Sasaki
patent: 6184465 (2001-02-01), Corisis
patent: 6194250 (2001-02-01), Melton et al.
patent: 6198172 (2001-03-01), King et al.
patent: 6208519 (2001-03-01), Jiang et al.
patent: 6210992 (2001-04-01), Tandy et al.
patent: 6212767 (2001-04-01), Tandy
patent: 6215175 (2001-04-01), Kinsman
patent: 6218731 (2001-04-01), Huang et al.
patent: 6225689 (2001-05-01), Moden et al.
patent: 6228548 (2001-05-01), King et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6235554 (2001-05-01), Akram et al.
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6252308 (2001-06-01), Akram et al.
patent: 6258623 (2001-07-01), Moden et al.
patent: 6258624 (2001-07-01), Corisis
patent: 6259153 (2001-07-01), Corisis
patent: 6261865 (2001-07-01), Akram
patent: 6265763 (2001-07-01), Jao et al.
patent: 6271058 (2001-08-01), Yoshida
patent: 6277671 (2001-08-01), Tripard
patent: 6281577 (2001-08-01), Oppermann et al.
patent: 6284571 (2001-09-01), Corisis et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6294839 (2001-09-01), Mess et al.
patent: 6297547 (2001-10-01), Akram
patent: 6303981 (2001-10-01), Moden
patent: 6303985 (2001-10-01), Larson et al.
patent: 6310288 (2001-10-01), Moden
patent: 6310390 (2001-10-01), Moden
patent: 6312977 (2001-11-01), Jiang et al.
patent: 6314639 (2001-11-01), Corisis
patent: 6316285 (2001-11-01), Jiang et al.
patent: 6316727 (2001-11-01), Liu
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6326242 (2001-12-01), Brooks et al.
patent: 6326244 (2001-12-01), Brooks et al.
patent: 6326687 (2001-12-01), Corisis
patent: 6326697 (2001-12-01), Farnworth
patent: 6326698 (2001-12-01), Akram
patent: 6329220 (2001-12-01), Bolken et al.
patent: 6331221 (2001-12-01), Cobbley
patent: 6331453 (2001-12-01), Bolken et al.
patent: 6332766 (2001-12-01), Thummel
patent: 6333564 (2001-12-01), Katoh et al.
patent: 6342728 (2002-01-01), Miyazaki et al.
patent: 6365434 (2002-04-01), Rumsey et al.
patent: 6385049 (2002-05-01), Chia-Yu et al.
patent: 6396129 (2002-05-01), Hung et al.
patent: 6400033 (2002-06-01), Darveaux
patent: 6414396 (2002-07-01), Shim et al.
patent: 6429528 (2002-08-01), King et al.
patent: 6437446 (2002-08-01), Uchida
patent: 6448635 (2002-09-01), Glenn
patent: 6451709 (2002-09-01), Hembree
patent: 6455354 (2002-09-01), Jiang
patent: 6479323 (2002-11-01), Lo et al.
patent: 6501170 (2002-12-01), Dickey et al.
patent: 6503776 (2003-01-01), Pai et al.
patent: 6528408 (2003-03-01), Kinsman
patent: 6528722 (2003-03-01), Huang et al.
patent: 6541872 (2003-04-01), Schrock et al.
patent: 6548376 (2003-04-01), Jiang
patent: 6548757 (2003-04-01), Russell et al.
patent: 6552426 (2003-04-01), Ishio et al.
patent: 6552910 (2003-04-01), Moon et al.
patent: 6558600 (2003-05-01), Williams et al.
patent: 6560117 (2003-05-01), Moon
patent: 6561479 (2003-05-01), Eldridge
patent: 6564979 (2003-05-01), Savaria
patent: 6576494 (2003-06-01), Farnworth
patent: 6576495 (2003-06-01), Jiang et al.
patent: 6589820 (2003-07-01), Bolken
patent: 6592783 (2003-07-01), Kumakura et al.
patent: 6593662 (2003-07-01), Pu et al.
patent: 6607937 (2003-08-01), Corisis
patent: 6614092 (2003-09-01), Eldridge et al.
patent: 6622380 (2003-09-01), Grigg
patent: 6638595 (2003-10-01), Rumsey et al.
patent: 6644949 (2003-11-01), Rumsey et al.
patent: 6653173 (2003-11-01), Bolken
patent: 6656769 (2003-12-01), Lee et al.
patent: 6661104 (2003-12-01), Jiang et al.
patent: 6664139 (2003-12-01), Bolken
patent: 6670719 (2003-12-01), Eldridge et al.
patent: 6672325 (2004-01-01), Eldridge
patent: 6673649 (2004-01-01), Hiatt et al.
patent: 6724076 (2004-04-01), Kahlisch et al.
patent: 6753613 (2004-06-01), Levardo et al.
patent: 6770164 (2004-08-01), Schrock et al.
patent: 6781849 (2004-08-01), Baek et al.
patent: 6836002 (2004-12-01), Chikawa et al.
patent: 6838754 (2005-01-01), Kim
patent: 6841858 (2005-01-01), Shim et al.
patent: 6844618 (2005-01-01), Jiang et al.
patent: 6885093 (2005-04-01), Lo et al.
patent: 6906424 (2005-06-01), Kinsman
patent: 7091064 (2006-08-01), Jiang
patent: 7109588 (2006-09-01), Jiang
patent: 2002/0074645 (2002-06-01), Dickey et al.
patent: 2002/0160185 (2002-10-01), Nagai et al.
patent: 2003/0134451 (2003-07-01), Chen
patent: 2003/0189262 (200
Micro)n Technology, Inc.
Perkins Coie LLP
Thai Luan C
LandOfFree
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