Method and apparatus for applying a layer of photosensitive mate

Details Method and apparatus for applying a layer of photosensitive mate Method and apparatus for applying a layer of photosensitive mate

1985-11-06

1987-05-26

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

118 52, 156345, 156655, 156668, 427240, B44C 122, C03C 1500, B29C 3700, B05C 1112

Patent

active

046683348

ABSTRACT:
In a method of applying a layer of photosensitive material to a semiconductor material wafer (3), the photosensitive material is applied in liquid form to the wafer and the wafer is then rotated in order to obtain the desired thickness of the layer. Photosensitive material (7) present at the edge (6) of the wafer (3) is removed by means of a jet of a liquid directed onto this edge to dissolve the photosensitive material, the jet being directed first to an area beyond the wafer of semiconductor material, where upon the jet of liquid is directed to the edge of the wafer and finally the jet of liquid is directed again to an area beyond the wafer and the supply of liquid is switched off.

REFERENCES:
patent: 3041225 (1962-06-01), Emeis
patent: 4075044 (1978-02-01), Sager et al.
patent: 4557785 (1985-12-01), Ohkuma

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