Method and apparatus for analyzing defect data and a review...

Details Method and apparatus for analyzing defect data and a review... Method and apparatus for analyzing defect data and a review...

2003-09-25

2010-10-12

Le, Vu (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

Reexamination Certificate

active

07813539

ABSTRACT:
In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects.

REFERENCES:
patent: 5982920 (1999-11-01), Tobin et al.
patent: 5991699 (1999-11-01), Kulkarni et al.
patent: 6009545 (1999-12-01), Tsutsui et al.
patent: 6130959 (2000-10-01), Li
patent: 6408105 (2002-06-01), Maruo
patent: 7016526 (2006-03-01), Smilansky et al.
patent: 7068834 (2006-06-01), Ikeda et al.
patent: A-6-61314 (1983-08-01), None
patent: A-10-214866 (1998-08-01), None
patent: A-11-45919 (1999-02-01), None

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