Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-08-28
2000-08-08
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438612, 438613, 438614, 438615, 438975, 2281801, 22818021, 22818022, H01L 2144
Patent
active
061001759
ABSTRACT:
A method for aligning and bonding balls to substrates, such as semiconductor wafers, dice and packages, is provided. The method employs a ball retaining plate having a pattern of micromachined cavities and vacuum conduits for retaining the balls. In addition, a substrate alignment member attached to the ball retaining plate, aligns the substrate to the balls. Using the substrate alignment member, bonding sites on the substrate can be placed in physical contact with the balls which are held by vacuum on the ball retaining plate. Next, the ball alignment plate and substrate can be place in a furnace for reflowing and bonding the balls to the bonding sites. An apparatus for performing the method includes the ball retaining plate and the substrate alignment member. A system for performing the method includes a ball loader mechanism for loading balls onto the ball retaining plate, and a vacuum fixture for applying a vacuum to the ball retaining cavities.
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Akram Salman
Hembree David R.
Hess Mike
Wood Alan G.
Gratton Stephen A.
Micro)n Technology, Inc.
Niebling John F.
Zarneke David
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