Method and apparatus for aligning an opaque mask with an integra

Radiant energy – Means to align or position an object relative to a source or...

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2504922, G01N 2100, G01N 2300

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active

043353134

ABSTRACT:
There are disclosed method and apparatus for precisely aligning the pattern of an opaque mask with a previously exposed pattern on a silicon wafer. Three separate optical channels are aligned so that their axes coincide with three targets on the wafer. The objectives are also adjusted to the same vertical distance from the wafer. Thereafter, the optical channels remain fixed. The wafer is retracted a short distance and is replaced by the mask which also has three targets. The mask is then shifted to align the targets with the prealigned optical axes. When mask alignment is completed, the mask and the wafer are removed as a unit to an exposure station.

REFERENCES:
patent: 3648048 (1972-03-01), Cahan et al.
patent: 3683195 (1972-08-01), Johannsmeier et al.
patent: 3742229 (1973-06-01), Smith et al.
patent: 3745358 (1973-07-01), Firtz et al.
patent: 3843916 (1974-10-01), Trotel et al.

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