Method and apparatus for accommodating thermal expansion and oth

Details Method and apparatus for accommodating thermal expansion and oth Method and apparatus for accommodating thermal expansion and oth

1987-07-28

1989-01-31

Crane, Daniel C.

Metal deforming

With cutting

By shearing tool-couple

72348, B21D 2802

Patent

active

048007439

ABSTRACT:
A method of controlling the spacing between a material forming punch and a complemental die includes advancing a punch shell and a pressure sleeve into engagement with the material and holding the material with the sleeve and blanking it with the punch shell. The material is then preliminarily formed by clamping the periphery between the pressure sleeve and a die core ring and advancing a punch core past the top of the die core ring and clamping the material against a die core to establish the desired dimension. The material is then finally formed by further advancement of the punch core with the die core and die core ring moving together. The apparatus includes a die core and die core ring which are concentrically arranged and independently supported but movable into engagement with each other after a predetermined amount of travel so as to move together through any further travel caused by movement of a punch core against the die core.

REFERENCES:
patent: 1930565 (1933-10-01), Rode et al.
patent: 2413591 (1946-12-01), Sturdy
patent: 3695084 (1972-10-01), Siemonsen et al.
patent: 3902347 (1975-09-01), Ridgway et al.
patent: 3948075 (1976-04-01), Finsterwalder et al.
patent: 4051707 (1977-10-01), Valek et al.
patent: 4125009 (1978-11-01), Byrd et al.
patent: 4206701 (1980-06-01), Hemmelgarn
patent: 4207048 (1980-06-01), Seymour
patent: 4249410 (1981-02-01), Crago et al.
patent: 4375785 (1983-03-01), Schoch et al.
patent: 4377084 (1983-03-01), Kaminski
patent: 4455114 (1984-06-01), Zysset
patent: 4624125 (1986-11-01), Bulso, Jr. et al.

Affiliated with

Also associated with

Rating

Method and apparatus for accommodating thermal expansion and oth does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for accommodating thermal expansion and oth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for accommodating thermal expansion and oth will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-171745