Method and apparatus for a semiconductor device having a radiati

Details Method and apparatus for a semiconductor device having a radiati Method and apparatus for a semiconductor device having a radiati

1992-03-13

1994-03-22

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257702, 257796, H01L 2302, H01L 2328, H01L 2312

Patent

active

052967409

ABSTRACT:
A semiconductor device includes a stage having top and bottom surfaces, a semiconductor element which is mounted on the top surface of the stage, a package part which is made of a first resin and encapsulates the semiconductor element so that a surface of the package part and the bottom surface of the stage lie on substantially the same plane, and a radiation part which is made of a second resin and is provided directly on the bottom surface of the stage and the surface of the package part. The second resin includes a filler material selected from a group consisting of metal powders and insulator powders so that a thermal conduction of the second resin is greater than that of the first resin.

REFERENCES:
patent: 4835598 (1989-05-01), Higuchi et al.
patent: 5057903 (1991-10-01), Olla
patent: 5151777 (1992-09-01), Akin et al.

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