Method and an apparatus for polishing wafer chamfers

Details Method and an apparatus for polishing wafer chamfers Method and an apparatus for polishing wafer chamfers

1993-01-22

1994-05-31

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156636, 156662, 156345, 437225, 51281R, 51 2R, 51DIG15, B44C 122, H01L 21306, H01L 21463

Patent

active

053166205

ABSTRACT:
A method for polishing peripheral chamfers of a semiconductor wafer comprising steps of: (a) turning a cylindrical cup-like rotatory buff having an internal polish groove formed in the inner wall surface thereof, the groove having a profile complementary to the profile of the chamfered wafer edge to be polished; (b) disposing the wafer inside the turning buff; (c) turning the wafer at a relatively low rate; and (d) pressing the wafer edge into the running internal polish groove with an appropriate pressure; furthermore there is proposed an apparatus for this novel method including the cylindrical cup-like rotatory buff as described above.

REFERENCES:
patent: 4897369 (1990-01-01), Beretta et al.
patent: 5110764 (1992-05-01), Ogino
patent: 5128281 (1992-07-01), Dyer et al.

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