Method and an apparatus for offsetting plasma bias voltage in bi

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

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361235, 279128, H02N 1300

Patent

active

059333146

ABSTRACT:
A control circuit configured to control a reference voltage of a reference node of an electrostatic chuck power supply is disclosed. The electrostatic chuck power supply is configured to clamp a substrate to a bipolar electrostatic chuck. The electrostatic chuck has a first buried conductor and a second buried conductor. The electrostatic chuck power supply has a first output configured for being coupled with the first buried plate. The first output has a first output voltage referenced to the reference voltage of the reference node. The electrostatic chuck power supply also has a second output configured for being coupled with the second buried plate. The first output has a first output voltage referenced to the reference voltage of the reference node. The control circuit includes: a first resistor coupled in series with the first output; a first amplifier coupled to the first resistor for sensing a voltage drop across the first resistor; a second resistor in series with said second output; and a second amplifier coupled to the second resistor for sensing a voltage drop across the second resistor.

REFERENCES:
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5557215 (1996-09-01), Saeki et al.
patent: 5699223 (1997-12-01), Mashiro et al.
patent: 5708250 (1998-01-01), Benjamin et al.
patent: 5737175 (1998-04-01), Grosshart et al.

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